Toshiba reveals new 3D flash chip that can store 1TB
Toshiba has begun shipping samples of its third-generation 3D NAND flash chip technology, which stacks 64 layers of flash cells and has 65% greater capacity than the previous generation technology, which used 48 layers. “This increases memory capacity per silicon wafer and leads to a reduction of cost-per-bit,” Toshiba said in a statement. Toshiba Based…