3D NAND, which stacks layer upon layer of flash cells atop one another like a microscopic skyscraper, will become the prominent technology for all flash memory this year, according to a new report.
According to DRAMeXchange’s latest forecast, NAND flash manufacturers have focused their efforts on converting fabrication plants to 3D NAND, which is denser, faster and less expensive to produce than traditional 2D (planar) NAND.
ToshibaBiCS (Bit Cost Scaling) is the vertical stacking or 3D technology that WD and partner Toshiba use to produce solid state drives and other NAND flash products. Their latest memory stores three bits of data per cell and stacks those cells 64-layers high.
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